PART |
Description |
Maker |
0022284106 |
2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Vertical, 10 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
0901200960 90120-0960 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Vertical, 40 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
0901200776 90120-0776 |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Vertical, 16 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
90147-1111 0901471111 |
2.54mm (.100) Pitch C-Grid庐 PC Board Connector, Single Row, Vertical, 11 Circuits 2.54mm (.100) Pitch C-Grid? PC Board Connector, Single Row, Vertical, 11 Circuits
|
Molex Electronics Ltd.
|
90147-1105 0901471105 |
2.54mm (.100) Pitch C-Grid? PC Board Connector, Single Row, Vertical, 5 Circuits 2.54mm (.100) Pitch C-Grid垄莽 PC Board Connector, Single Row, Vertical, 5 Circuits
|
Molex Electronics Ltd.
|
87914-2216 0879142216 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
87914-3616 0879143616 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
0015910080 015-91-0080 71308-0108N |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating MOLEX Connector
|
Molex Electronics Ltd.
|
0015910140 015-91-0140 A713080114N |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 14 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating MOLEX Connector
|
Molex Electronics Ltd.
|
0702800448 70280-0448 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, Tin (Sn) Plating, 2.72mm (.107) PC Tail Length MOLEX Connector
|
Molex Electronics Ltd.
|
22-28-0061 |
2.54mm (.100) Pitch KK庐 Header, Breakaway, Vertical, with Friction Lock, 6 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating 2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, with Friction Lock, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
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